Molding for large panel fan-out package
The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined area.
1. A method of manufacturing a semiconductor device package, comprising:
providing a carrier having a predetermined area;
disposing a semiconductor device on the predetermined area;
forming a sacrificial wall on a periphery of the predetermined area, the sacrificial wall comprising a polymer material; and
removing the sacrificial wall.
2. The method of claim 1 , wherein removing the sacrificial wall is performed by at least one of an optical technique, a mechanical technique, a thermal technique or a chemical technique.
3. The method of claim 1 , further comprising forming an encapsulant covering the semiconductor device prior to the formation of the sacrificial wall.
4. The method of claim 3 , further comprising forming a cavity in the encapsulant to accommodate the sacrificial wall.
5. The method of claim 4 , wherein the cavity is formed such that a sidewall defining the cavity and a bottom defining the cavity forms an angle in a range from approximately 45 degrees to approximately 90 degrees.
6. The method of claim 1 , further comprising:
forming an encapsulant covering the semiconductor device; and
removing the carrier.
7. The method of claim 6 , further comprising disposing an adhesive film on the encapsulant subsequent to removing the carrier.
8. The method of claim 7 , further comprising applying an expanding force on the encapsulant.
9. The method of claim 1 , further comprising forming an encapsulant covering the semiconductor device subsequent to forming the sacrificial wall.
10. The method of claim 9 , further comprising removing the carrier.
11. The method of claim 10 , further comprising removing the sacrificial wall.
12. The method of claim 11 , further comprising disposing a first adhesive film on a first surface of the encapsulant, and disposing a second adhesive film on a second surface of the encapsulant, wherein the second surface is opposite to the first surface.
13. The method of claim 7 , further comprising applying a force in a first direction on the adhesive film.
14. The method of claim 7 , further comprising removing the adhesive film to form the semiconductor device package.
15. The method of claim 7 , further comprising cutting the encapsulant to form the semiconductor device package.
16. The method of claim 10 , wherein the encapsulant has a first surface, the method further comprising forming a first adhesive film on the first surface of the encapsulant subsequent to removing the carrier.
17. The method of claim 16 , further comprising removing the sacrificial wall to form the semiconductor device package.
18. The method of claim 17 , wherein the encapsulant has a second surface opposite to the first surface, the method further comprising forming a second adhesive film on the second surface of the encapsulant.
19. The method of claim 18 , further comprising removing the first adhesive film to form the semiconductor device package.