Patent Assignment
Reel/Frame 044606/0274
Assignment of Assignor's Interest
Recorded: 2018-01-12
Pages: 2
Assignors
CHEN, MENG-HSIN
Executed: 2018-01-03
LIN, CHIH-HSIANG
Executed: 2018-01-03
CHIU, JEN-CHUN
Executed: 2018-01-03
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Thin Film and Method for Manufacturing the Same and Copper Clad Laminate