Patent Assignment
Reel/Frame 044609/0856
Assignment of Assignor's Interest
Recorded: 2018-01-12
Pages: 7
Assignors
KIM, JONG-YOUN
Executed: 2017-12-06
LEE, SEOK-HYUN
Executed: 2017-12-06
MIN, YOUN-JI
Executed: 2017-12-06
SUK, KYOUNG-LIM
Executed: 2017-12-06
LEE, SEOK-WON
Executed: 2017-12-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same