Semiconductor package and method of manufacturing the same
A semiconductor package may include a semiconductor chip; a molding portion configured to surround at least a side surface of the semiconductor chip; a passivation layer including a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, below the semiconductor chip; and a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer. The redistribution layer portion may include: an upper pad connected to the contact plug and a fine pattern positioned at a same level as the upper pad in an upper part of the redistribution layer portion; a redistribution layer and a via plug, which has a widening width further away from the semiconductor chip in the vertical direction, in a body part of the redistribution layer portion; and a lower pad connected to the external connection terminal and exposed to an outside of the semiconductor package in a lower part of the redistribution layer portion.
1. A semiconductor package comprising:
a semiconductor chip;
a molding portion configured to surround at least two side surfaces of the semiconductor chip;
a passivation layer comprising a contact plug directly connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, the passivation layer being disposed below the semiconductor chip; and
a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer,
wherein the redistribution layer portion comprises:
an upper pad connected to the contact plug and a fine pattern positioned at a same level as and separately from the upper pad in an upper part of the redistribution layer portion;
a redistribution layer and a via plug, which has a widening width further away from the semiconductor chip in the vertical direction, in a body part of the redistribution layer portion; and
a lower pad connected to the external connection terminal and exposed to an outside of the semiconductor package, in a lower part of the redistribution layer portion,
wherein the redistribution layer portion further comprises an insulating portion, and
wherein the insulating portion includes a material different from the passivation layer.
2. The semiconductor package of claim 1 , wherein the redistribution layer portion comprises a plurality of fine patterns, and some of the plurality of fine patterns are located between two adjacent upper pads, and
wherein a width of each of the plurality of fine patterns is smaller than a width of the redistribution layer.
3. The semiconductor package of claim 1 , wherein a side surface of the contact plug is covered with the passivation layer,
wherein a side surface of the upper pad is covered with the insulating portion, and
wherein a side surface of the lower pad is not covered with the insulating portion.
4. The semiconductor package of claim 1 , wherein an upper surface of the upper pad, an upper surface of the fine pattern, and an upper surface of the insulating portion are substantially coplanar with each other.
5. The semiconductor package of claim 1 , further comprising an underfill configured to fill between the semiconductor chip and the contact plug.
6. The semiconductor package of claim 5 , wherein the upper pad and the fine pattern are not in contact with the underfill.
7. The semiconductor package of claim 1 , wherein a tapered trapezoidal shape of a vertical cross-section of the contact plug and a tapered trapezoidal shape of a vertical cross-section of the via plug are tapered in directions opposite to each other.
8. A semiconductor package:
a semiconductor chip;
a molding portion configured to surround at least a side surface of the semiconductor chip;
a passivation layer comprising a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, the passivation layer being disposed below the semiconductor chip; and
a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer,
wherein the redistribution layer portion comprises:
an upper pad connected to the contact plug and a fine pattern positioned at a same level as the upper pad in an upper part of the redistribution layer portion;
a redistribution layer and a via plug, which has a widening width further away from the semiconductor chip in the vertical direction, in a body part of the redistribution layer portion; and
a lower pad connected to the external connection terminal and exposed to an outside of the semiconductor package, in a lower part of the redistribution layer portion, and
wherein the contact plug and the via plug are made of different materials.
9. The semiconductor package of claim 1 , wherein, when the semiconductor package is viewed from above, an area of the molding portion is larger than an area of the semiconductor chip and substantially same as an area of the redistribution layer portion.