Patent Assignment
Reel/Frame 044659/0735
Assignment of Assignor's Interest
Recorded: 2018-01-18
Pages: 7
Assignors
LEE, SEUNG WOO
Executed: 2016-08-11
KIM, BYONG JIN
Executed: 2016-08-11
BANG, WON BAE
Executed: 2016-08-11
KANG, SANG GOO
Executed: 2016-08-11
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method for Fabricating Semiconductor Package and Semiconductor Package Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.