Patent Assignment
Reel/Frame 044691/0136
Assignment of Assignor's Interest
Recorded: 2018-01-22
Pages: 8
Assignors
JUNG, EUN JI
Executed: 2017-06-13
KIM, RAK HWAN
Executed: 2017-06-21
KIM, BYUNG HEE
Executed: 2017-05-29
KIM, YOUNG HUN
Executed: 2017-06-13
HAN, GYEONG YUN
Executed: 2017-06-22
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same