Patent Assignment
Reel/Frame 044694/0946
Assignment of Assignor's Interest
Recorded: 2018-01-23
Pages: 4
Assignors
HUANG, JIAN-SHIOU
Executed: 2017-12-19
TANG, BANG-TAI
Executed: 2017-12-19
PENG, CHIH-TANG
Executed: 2017-12-20
HUANG, TAI-CHUN
Executed: 2017-12-20
HUANG, YEN-CHUN
Executed: 2017-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Formation and in-Situ Treatment Processes for Gap Fill Layers