Formation and in-situ treatment processes for gap fill layers
The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a semiconductor device having an enhanced gap fill layer in trenches. The present disclosure provides a novel gap fill layer formed using a multi-step deposition and in-situ treatment process. The deposition process can be a flowable chemical vapor deposition (FCVD) utilizing one or more assist gases and molecules of low reactive sticking coefficient (RSC). The treatment process can be an in-situ process after the deposition process and includes exposing the deposited gap fill layer to plasma activated assist gas. The assist gas can be formed of ammonia. The low RSC molecule can be formed of trisilylamin (TSA) or perhydropolysilazane (PHPS).
1. A method of fabricating a semiconductor structure, the method comprising:
forming a recess in the semiconductor structure, wherein the recess comprises sidewalls and a bottom surface;
depositing a silicon nitride gap fill sub-layer on the sidewalls and the bottom surface using a chemical vapor deposition (CVD) process, wherein the CVD process uses low reactive sticking coefficient (RSC) molecules and a first group of assist gases;
treating the silicon nitride gap fill sub-layer by exposing the silicon nitride gap fill sub-layer to a second group of assist gases; and
repeating the depositing and the treating to form one or more silicon nitride gap fill sub-layers on the silicon nitride gap fill sub-layer.
2. The method of claim 1 , wherein the low RSC molecules comprise trisilylamin (TSA).
3. The method of claim 1 , wherein the low RSC molecules comprise perhydropolysilazane (PHPS).
4. The method of claim 1 , wherein the first and second groups of assist gases comprise ammonia, nitrogen, helium, or argon.
5. The method of claim 1 , wherein an aspect ratio of the recess is in a range of about 6-20.
6. The method of claim 1 , wherein the treating is performed at a temperature between about 10° C. and about 200° C.
7. The method of claim 1 , wherein the CVD process comprises a plasma-enhanced CVD (PECVD), an atomic laser deposition (ALD), or a plasma-enhanced ALD (PEALD).
8. The method of claim 1 , wherein the CVD process comprises a flowable CVD (FCVD).
9. The method of claim 1 , further comprising performing an in-situ ultraviolet (UV) curing process on the silicon nitride gap fill sub-layer using UV light.
10. The method of claim 1 , wherein the silicon nitride gap fill sub-layer and the one or more silicon nitride gap fill sub-layers partially fill the recess.
11. A method of fabricating a semiconductor structure, the method comprising:
forming a conductive structure over a substrate;
etching the conductive structure to form openings;
depositing a first sub-layer of a gap fill layer in the openings by a flowable chemical vapor deposition (FCVD) process using low reactive sticking coefficient (RSC) molecules and a first group of assist gases;
exposing the first sub-layer to a second group of assist gases;
depositing a second sub-layer of the gap fill layer over the first sub-layer, wherein the second sub-layer is formed by the FCVD process; and
exposing the second sub-layer to the second group of assist gases.
12. The method of claim 11 , wherein the low RSC molecules comprise trisilylamin (TSA).
13. The method of claim 11 , wherein the low RSC molecules comprise perhydropolysilazane (PHPS).
14. The method of claim 11 , wherein the gap fill layer comprises silicon nitride.
15. The method of claim 11 , wherein the first and second groups of assist gases comprise ammonia, nitrogen, helium, or argon.
16. A method of fabricating a semiconductor structure, the method comprising:
forming first and second fins on a substrate;
forming a gate electrode on the first and second fins;
etching the gate electrode to form an opening between the first and second fins;
performing a flowable chemical vapor deposition (FCVD) process using low reactive sticking coefficient (RSC) molecules and a first group of assist gases to form a silicon nitride gap fill layer in the opening; and
exposing the silicon nitride gap fill layer to a plasma-activated second group of assist gases, wherein the second group of assist gas comprises ammonia, nitrogen, helium, or argon.
17. The method of claim 16 , wherein the low RSC molecules comprise trisilylamin (TSA).
18. The method of claim 16 , wherein the first group of assist gases comprises ammonia, nitrogen, helium, or argon.
19. The method of claim 16 , further comprising performing an in-situ ultraviolet (UV) curing process on the silicon nitride gap fill layer using UV light.
20. The method of claim 19 , wherein a thickness of the silicon nitride gap fill layer is greater than a penetration depth of the UV light into the silicon nitride gap fill layer.