Patent Assignment
Reel/Frame 044701/0303
Assignment of Assignor's Interest
Recorded: 2018-01-23
Pages: 4
Assignees
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
UNIVERSITEIT GENT
ST. PIETERSNIEUWSTRAAT 25, GENT, 9000, BELGIUM
Covered Property
(1)
Method for Bonding Thin Semiconductor Chips to a Substrate