Patent Assignment
Reel/Frame 044740/0979
Assignment of Assignor's Interest
Recorded: 2018-01-26
Pages: 5
Assignors
WIETSTRUCK, MATTHIAS
Executed: 2018-01-15
KAYNAK, MEHMET
Executed: 2018-01-19
KULSE, PHILIP
Executed: 2018-01-15
LISKER, MARCO
Executed: 2018-01-15
MARSCHMEYER, STEFFEN
Executed: 2018-01-15
WOLANSKY, DIRK
Executed: 2018-01-15
Assignee
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK
IM TECHNOLOGIEPARK 25, FRANKFURT (ODER), 15236, GERMANY
Covered Property
(1)
Technological Method for Preventing, by Means of Buried Etch Stop Layers, the Creation of Vertical/Lateral Inhomogeneities When Etching Through-Silicon Vias