Patent Assignment
Reel/Frame 044796/0015
Change of Name
Recorded: 2017-11-17
Pages: 5
Assignor
OERLIKON ADVANCED TECHNOLGIES AG
Executed: 2015-02-23
Assignee
EVATEC ADVANCED TECHNOLOGIES AG
IRAMALI 18, BALZERS, 9496, LIECHTENSTEIN
Covered Properties
(6)
Reactive Sputtering with Hipims
Reactive Sputtering with Multiple Sputter Sources
Application:
13/258,576 →
Publication:
US 2012/0031749
Rf Substrate Bias with High Power Impulse Magnetron Sputtering (Hipims)
Adapter for Vacuum-Insulated Lines
Processing Arrangement with Temperature Conditioning Arrangement and Method of Processing a Substrate
Application:
14/424,172 →
Publication:
US 2015/0228530
Method for Manufacturing Workpieces and Apparatus
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2009
From: WEICHART, JUERGEN; KADLEC, STANISLAV; ELGHAZZALI, MOHAMED
To: OC OERLIKON BALZERS AG
Reel/Frame 022446/0813 →
Assignment of Assignor's Interest
Nov 8, 2011
From: DUBS, MARTIN; RUHM, KURT; ROHRMANN, HARTMUT
To: OC OERLIKON BALZERS AG
Reel/Frame 027192/0308 →
Assignment of Assignor's Interest
Jan 29, 2014
From: OC OERLIKON BALZERS AG
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 032068/0943 →
Assignment of Assignor's Interest
Apr 2, 2015
From: BLESS, MARTIN
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 035319/0043 →
Assignment of Assignor's Interest
May 26, 2015
From: ROHRMANN, HARTMUT; KRATZER, MARTIN
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 035707/0938 →
Assignment of Assignor's Interest
Feb 19, 2018
From: EVATEC ADVANCED TECHNOLOGIES AG
To: EVATEC AG
Reel/Frame 044965/0061 →