Patent Assignment
Reel/Frame 044826/0141
Assignment of Assignor's Interest
Recorded: 2018-02-04
Pages: 8
Assignors
VERMA, PURAKH RAJ
Executed: 2018-01-29
LIN, CHIA-HUEI
Executed: 2018-01-29
YANG, KUO-YUH
Executed: 2018-01-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device Comprising a Deep Trench Isolation Structure and a Trap Rich Isolation Structure in a Substrate and a Method of Making the Same