Patent Assignment
Reel/Frame 044849/0367
Assignment of Assignor's Interest
Recorded: 2018-02-07
Pages: 3
Assignors
HUANG, YEN-LUN
Executed: 2018-01-17
LIU, JIA-ZHE
Executed: 2018-01-10
LIN, MAN-HSUAN
Executed: 2018-01-10
Assignee
GLOBALWAFERS CO., LTD.
NO. 8, INDUSTRIAL EAST ROAD 2,, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same