Patent Assignment
Reel/Frame 044856/0039
Assignment of Assignor's Interest
Recorded: 2018-02-07
Pages: 2
Assignor
CHEN, WEIMING CHRIS
Executed: 2018-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Having Die Structures of Different Heights