Patent Assignment
Reel/Frame 044881/0176
Assignment of Assignor's Interest
Recorded: 2018-02-09
Pages: 5
Assignors
LEE, YUN
Executed: 2018-01-12
KO, CHUNG-TING
Executed: 2018-01-16
LEE, CHEN-MING
Executed: 2018-01-12
WANG, MEI-YUN
Executed: 2018-01-12
YANG, FU-KAI
Executed: 2018-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Prevention Of Contact Bottom Void In Semiconductor Fabrication
Patent:
10,177,038 →
Application:
15/882,905 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.