IP Library › Assignment 046096/0791
Patent Assignment
Reel/Frame 046096/0791

Assignment of Assignor's Interest

Recorded: 2018-06-15 Pages: 5
Assignors
LEE, YUN
Executed: 2018-01-12
KO, CHUNG-TING
Executed: 2018-01-16
LEE, CHEN-MING
Executed: 2018-01-12
WANG, MEI-YUN
Executed: 2018-01-12
YANG, FU-KAI
Executed: 2018-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Prevention Of Contact Bottom Void In Semiconductor Fabrication
Application: 15/882,905 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 9, 2018
From: LEE, YUN; KO, CHUNG-TING; LEE, CHEN-MING; WANG, MEI-YUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 044881/0176 →