Patent Assignment
Reel/Frame 044885/0637
Assignment of Assignor's Interest
Recorded: 2018-02-09
Pages: 3
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Shape-Forming Packaging Material, and Method for Producing Power Storage Device with Surface Printing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.