Assignment of Assignor's Interest

Recorded: 2018-02-12 Pages: 10

Assignors

LIN, WEN-KAI

Executed: 2018-02-08

SHENG, YI-CHUNG

Executed: 2018-02-08

HSUEH, SHENG-YUAN

Executed: 2018-02-08

KANG, CHIH-KAI

Executed: 2018-02-08

Assignee

UNITED MICROELECTRONICS CORP.

NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN

Covered Property (1)

Method for Fabricating Single Diffusion Break Structure Directly Under a Gate Line

Patent: 10,256,155 →

Application: 15/893,709 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.