Patent Assignment
Reel/Frame 044956/0190
Assignment of Assignor's Interest
Recorded: 2018-02-16
Pages: 3
Assignor
LIN, JING-CHENG
Executed: 2013-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bonded Semiconductor Structures