Patent Assignment
Reel/Frame 044972/0753
Assignment of Assignor's Interest
Recorded: 2018-02-20
Pages: 10
Assignors
MOSTOVOY, MICHAEL
Executed: 2017-03-07
KUMAR, GOKUL
Executed: 2017-02-08
YE, NING
Executed: 2017-02-08
TAKIAR, HEM
Executed: 2017-03-07
RAMACHANDRA, VENKATESH P.
Executed: 2017-03-07
GHATAWADE, VINAYAK
Executed: 2017-02-10
LIAO, CHIH-CHIN
Executed: 2017-02-09
Assignee
SANDISK TECHNOLOGIES LLC
6900 DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Property
(1)
Wire Bonded Wide I/O Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →