Patent Assignment
Reel/Frame 044982/0194
Assignment of Assignor's Interest
Recorded: 2018-02-20
Pages: 5
Assignors
KIM, YEONG A
Executed: 2018-01-22
KIM, EUN SIL
Executed: 2018-01-23
KO, YOUNG GWAN
Executed: 2018-01-23
KUROYANAGI, AKIHISA
Executed: 2018-01-23
KIM, JIN SU
Executed: 2018-01-23
MYUNG, JUN WOO
Executed: 2018-01-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.