Patent Assignment
Reel/Frame 044984/0815
Assignment of Assignor's Interest
Recorded: 2018-02-21
Pages: 4
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Producing Bonded Soi Wafer