Patent Assignment
Reel/Frame 045004/0712
Assignment of Assignor's Interest
Recorded: 2018-02-22
Pages: 3
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Compound for Metal Powder Injection Molding, Metal Powder Molded Body, Method for Producing Sintered Body, and Sintered Body