IP Library Granted Patent US 10,675,682
Granted Patent B2
US 10,675,682 · App. 15/902,338 · Granted Jun 9, 2020

Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

Inventors: Hidefumi Nakamura (Hachinohe, JP); Yasutoshi Hideshima (Matsumoto, JP)
Assignee: Seiko Epson Corporation
B22F1/0059B22F1/0074B22F1/0096B22F3/225B22F7/06B22F3/1007B22F3/24B22F9/026B22F2001/0066B22F2003/247B22F2301/00B22F2301/35
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Quick Facts
Patent No.
US 10,675,682
App. No.
15/902,338
Granted
Jun 9, 2020
Kind
B2
Abstract

A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles composed of the same constituent material as the first metal particles and having a smaller average particle diameter than the first metal particles. The constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy.

Claims (19)

1. A compound for metal powder injection molding, comprising:

first metal particles bound to one another to form secondary particles, the first metal particles being bound to one another and collectively encapsulated by a first binder; and

second metal particles dispersed within a second binder to form a mixture;

the secondary particles being mixed into the mixture such that the secondary particles are bound together and collectively encapsulated by the second binder;

the second binder being different from the first binder;

the second metal particles being composed of a same constituent material as the first metal particles; and

the second metal particles having a smaller average particle diameter than the first metal particles.

2. The compound for metal powder injection molding according to claim 1 , wherein the constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy.

3. The compound for metal powder injection molding according to claim 1 , wherein the first metal particles are bound to one another in the secondary particles via a second binder.

4. The compound for metal powder injection molding according to claim 1 , wherein the first metal particles in the secondary particles are adhered to one another.

5. The compound for metal powder injection molding according to claim 1 , wherein the secondary particles are dispersed in the mixture of the second metal particles and the binder.

6. A metal powder molded body, comprising:

granulated particles; and

secondary particles molded with the granulated particles,

the secondary particles being composed of first metal particles that are bound to one another and collectively encapsulated by a first binder; and

the granulated particles being composed of second metal particles and a second binder, the secondary particles being dispersed throughout and entirely encapsulated by the second binder, the second metal particles being composed of a same constituent material as the first metal particles, the second metal particles having a smaller average particle diameter than the first metal particles.

7. A sintered body, comprising:

a plurality of first portions that each include a sintered material of first metal particles; and

a second portion that entirely encapsulates each of the plurality of first portions, the second portion including a sintered material of second metal particles composed of a same constituent material as the first portion, the second metal particles having a smaller average crystal grain diameter than the first portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2018
From: NAKAMURA, HIDEFUMI; HIDESHIMA, YASUTOSHI
To: SEIKO EPSON CORPORATION
Reel/Frame 045004/0712 →
Priority Claims (1)
JP 2017-033916 · Feb 24, 2017 · national
Continuity (1)
Related Publication 20180243824A1 · Aug 30, 2018
Cited By (4)
US 12,296,327 US 12,427,508 US 12,544,748 US 12,551,871