Patent Assignment
Reel/Frame 045020/0379
Assignment of Assignor's Interest
Recorded: 2018-02-23
Pages: 9
Assignors
SEDDON, MICHAEL J.
Executed: 2018-02-13
LIN, YUSHENG
Executed: 2018-02-23
NOMA, TAKASHI
Executed: 2018-02-16
OKADA, KAZUO
Executed: 2018-02-16
YOSHIMI, HIDEAKI
Executed: 2018-02-16
YOMADA, NAOYUKI
Executed: 2018-02-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device with Backmetal and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 6, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047734/0068 →
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064160/0027 →