Patent Assignment
Reel/Frame 064160/0027
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068
Recorded: 2023-06-23
Pages: 431
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(88)
Methods and Apparatus for an Image Sensor with a Multi-Branch Transistor
Image Sensors with Split Photodiodes
Press-Fit Power Module and Related Methods
Cascode Semiconductor Package and Related Methods
Hybrid Control Technique for Power Converters
Active Output Driver Supply Compensation for Noise Reduction
Power Supply Controller and Related Methods
Substrate Structures and Methods of Manufacture
Low Frequency Modulated Chirp Minimum Distance Measurement
Imaging Systems Having Broadband Monochromatic and Chromatic Image Sensors
Rotor Position Sensing System for Permanent Magnet Synchronous Motors and Related Methods
Adaptive Dynamic Element Matching of Circuit Components
Patent:
10,200,054 →
Application:
15/869,757 →
Semiconductor Packages with Leadframes and Related Methods
Reducing Mosfet Body Current
Patent:
10,115,818 →
Application:
15/871,231 →
Semiconductor Devices and Methods of Making the Same
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
Method of Separating Electronic Devices Having a Back Layer and Apparatus
High Power Module Semiconductor Package with Multiple Submodules
Apparatus and Method Related to Sensor Die Esd Protection
Methods and Apparatus for a Capacitive Touch Sensor
Adaptive Control of Synchronous Rectifier Switching Device
Bidirectional Current Sense Amplifier
Cascode Configured Semiconductor Component
Trench Semiconductor Device Having Shaped Gate Dielectric and Gate Electrode Structures and Method
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Battery Protection System with Reference Voltage Control System
Image Sensor Chip Scale Packages and Related Methods
TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs)
Trench-Gate Insulated-Gate Bipolar Transistors
Devices, Systems and Processes for Average Current Control
Low-Latency Streaming for Cros and Bicros
Devices, Systems and Processes for Average Current Control
Composite Acoustic Bursts for Multi-Channel Sensing
Response-Based Determination of Piezoelectric Transducer State
Measuring Resonance Parameters of Piezoelectric Transducers
Control Circuit for Programmable Power Supply
Packaged Semiconductor Devices with Multi-Use Input Contacts and Related Methods
Methods and Apparatus for a Current Circuit
Semiconductor Package with Chamfered Corners and Related Methods
Patent:
10,340,306 →
Application:
15/892,114 →
Semiconductor Copper Metallization Structure and Related Methods
Signal Communication for Circuit with Floating Ground
Patent:
10,236,772 →
Application:
15/892,609 →
Alternating Valley Switching for Power Converter
Electronic Device Including a Conductive Layer Including a Ta-Si Compound and a Process of Forming the Same
Application:
15/893,328 →
Publication:
US 2019/0252509
Level-Shifting Circuit Configured to Limit Leakage Current
Methods and Apparatus for Anti-Eclipse Circuit Verification
Image Sensors with Deep Silicon Etch and Related Methods
Error Rate Meter Included in a Semiconductor Die
Imaging Systems Having Dual Storage Gate Overflow Capabilities
Power Factor Correction Circuit and Driving Method Thereof
Semiconductor Device with Backmetal and Related Methods
Semiconductor Device and Method of Forming Cantilevered Protrusion on a Semiconductor Die
Negative Voltage Detection and Voltage Surge Protection
Image Sensors Having High Dynamic Range Functionalities
Semiconductor Wafer and Method of Probe Testing
Imaging Systems with Clear Filter Pixels
Methods and Apparatus for an Encoder
Method for Operating an Electronic Module
Low Noise Differential Amplifier
Electronic Device Including a Junction Field-Effect Transistor Having a Gate Within a Well Region and a Process of Forming the Same
Application:
15/909,622 →
Publication:
US 2019/0273169
Preamplifier and Method
Power Domain Having an Implementation of an on-Chip Voltage Regulator Device
Cascode Circuit Having a Gate of a Low-Side Transistor Coupled to a High-Side Transistor
Clip and Related Methods
Imaging Pixels with Storage Capacitors
Ignition Control System for a High-Voltage Battery System
Application:
15/914,370 →
Publication:
US 2019/0280464
Electronic Device Including a Transistor Including Iii-V Materials and a Process of Forming the Same
Patent:
10,269,947 →
Application:
15/916,428 →
Dual Conversion Gain Circuitry with Buried Channels
Imaging Systems with Boosted Control Signals
Schottky Device and Method of Manufacture
Multi-Chip Packages with Stabilized Die Pads
Variable Resistance Vias and Related Methods
Application:
15/920,880 →
Publication:
US 2018/0331045
Thinned Semiconductor Package and Related Methods
Embedded Stacked Die Packages and Related Methods
Application:
15/926,127 →
Publication:
US 2018/0211939
Methods and Apparatus for an Image Sensor Capable of Simultaneous Integration of Electrons and Holes
Smart Turn-Off for Gate Driver Circuit
Method of Forming a Power Supply Control Circuit and Structure Therefor
Patent:
10,193,448 →
Application:
15/935,840 →
Method of Separating a Back Layer on a Substrate Using Exposure to Reduced Temperature and Related Apparatus
CISCSP Package and Related Methods
Application:
15/939,582 →
Publication:
US 2019/0006531
Leadframe with Sockets for Solderless Pins
Ultra-Thin Multichip Power Devices
Fast Response for Current Doubling Dc-Dc Converter
Patent:
10,250,119 →
Application:
15/940,299 →
Current Doubling Dc-Dc Converter with Efficient Sleep Mode
Patent:
10,305,363 →
Application:
15/940,362 →
Leadframe with Efficient Heat Dissipation for Semiconductor Device Package Assembly
Patent:
10,361,148 →
Application:
15/941,424 →
Pulse Width Control for Switching Mode Power Converters
Methods and Apparatus for a Microphone System
Application:
62/620,707 →
Capacitors with Electrode Topography
Application:
62/621,265 →
Ultra-Low Leakage Diode Circuit
Application:
62/647,322 →
Electronic Device Including an Enhancement-Mode Hemt and a Method of Using the Same
Application:
62/649,249 →
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2018
From: MAURITZSON, RICHARD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044532/0219 →
Assignment of Assignor's Interest
Jan 8, 2018
From: OH, MINSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044558/0059 →
Assignment of Assignor's Interest
Jan 9, 2018
From: CHANG, JIE; CHEN, HUIBIN; MALDO, TIBURCIO; LEE, KEUNHYUK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044571/0280 →
Assignment of Assignor's Interest
Jan 9, 2018
From: LE, PHUONG TRONG; YOUNG, ALEXANDER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044577/0768 →
Assignment of Assignor's Interest
Jan 10, 2018
From: STULER, ROMAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044587/0624 →
Assignment of Assignor's Interest
Jan 11, 2018
From: LIN, YUSHENG; TAKAKUSAKI, SADAMICHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044602/0707 →
Assignment of Assignor's Interest
Jan 11, 2018
From: COENEN, IVO LEONARDUS; HEUBI, ALEXANDER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044598/0227 →
Assignment of Assignor's Interest
Jan 11, 2018
From: PFOF, ZDENEK; BUBLA, JIRI; VECERA, IVO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044602/0399 →
Assignment of Assignor's Interest
Jan 11, 2018
From: HUSTAVA, MAREK; SUCHY, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044603/0064 →
Assignment of Assignor's Interest
Jan 12, 2018
From: KANE, PAUL JAMES; JENKIN, ROBIN BRIAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044605/0810 →
Assignment of Assignor's Interest
Jan 12, 2018
From: OKUBAYASHI, MASANORI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044606/0685 →
Assignment of Assignor's Interest
Jan 15, 2018
From: SEDDON, MICHAEL J.; NOMA, TAKASHI; SATO, KAZUHIRO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044622/0835 →
Assignment of Assignor's Interest
Jan 15, 2018
From: EGGERMONT, JEAN-PAUL; JANSSENS, JOHAN CAMIEL JULIA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044620/0386 →
Assignment of Assignor's Interest
Jan 15, 2018
From: CELAYA, PHILLIP; LETTERMAN, JAMES P., JR.; MARQUIS, ROBERT L.; TRUHITTE, DARRELL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044620/0851 →
Assignment of Assignor's Interest
Jan 15, 2018
From: ST. GERMAIN, STEPHEN; ARBUTHNOT, ROGER M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044621/0872 →
Assignment of Assignor's Interest
Jan 17, 2018
From: JASA, HRVOJE; DAIGLE, TYLER; JORDAN, ANDREW; MAHER, GREGORY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044642/0528 →
Assignment of Assignor's Interest
Jan 18, 2018
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044657/0120 →
Assignment of Assignor's Interest
Jan 25, 2018
From: CHANG, JIE; CHEN, HUIBIN; LEE, KEUNHYUK; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044726/0412 →
Security Interest
Dec 6, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047734/0068 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →