Clip and related methods
View Patent ↗Implementations of a clip for a semiconductor package may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.
1. A method of making a semiconductor package, the method comprising:
patterning and etching a substrate to form a first collector, a second collector, and an emitter;
applying bonding material to the first collector, the second collector, and the emitter;
coupling a first die to the first collector and a second die to the second collector;
applying bonding material to the first die and to the second die; and
simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip to the first die, to the second die, and to the emitter through the bonding material.
2. The method of claim 1 , wherein the substrate comprises of at least one of copper, silicon, and any combination thereof.
3. The method of claim 1 , wherein the bonding material is selected from the group consisting of a solder paste, a solder wire, a preform solder, a sintered Ag metal, a sintered Ag laminate, and any combination thereof.
4. The method of claim 1 , wherein the clip comprises an electrically conductive material selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, steel, brass, nickel, tin, and any combination thereof.
5. The method of claim 1 , wherein the first die is one of an insulated gate bipolar transistor (IGBT) and a rectifier.
6. The method of claim 1 , wherein the second die is one of an IGBT and a rectifier.
7. The method of claim 1 , wherein the second end of the clip is coupled to a terminal.
8. The method of claim 1 , wherein the emitter is comprised of silicon.
9. A method of making a semiconductor package, the method comprising:
patterning and etching a substrate to form a first collector, a second collector, and an emitter therein where the emitter is located between the first collector and the second collector;
applying bonding material to the first collector, the second collector, and the emitter;
coupling a first die to the first collector and a second die to the second collector;
applying bonding material to the first die and to the second die; and
simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip to the first die, to the second die, and to the emitter through the bonding material.
10. The method of claim 9 , wherein the substrate comprises of at least one of copper, silicon, and any combination thereof.
11. The method of claim 9 , wherein the bonding material is selected from the group consisting of a solder paste, a solder wire, a preform solder, a sintered Ag metal, a sintered Ag laminate, and any combination thereof.
12. The method of claim 9 , wherein the clip comprises an electrically conductive material selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, steel, brass, nickel, tin, and any combination thereof.
13. The method of claim 9 , wherein the first die is one of an insulated gate bipolar transistor (IGBT) and a rectifier.
14. The method of claim 9 , wherein the second die is one of an IGBT and a rectifier.
15. The method of claim 9 , wherein the second end of the clip is coupled to a terminal.
16. The method of claim 9 , wherein the emitter is comprised of silicon.
17. A method of making a semiconductor package, the method comprising:
patterning and etching a substrate to form a first collector, a second collector, and an emitter therein where the emitter is located between the first collector and the second collector;
applying bonding material to the first collector, the second collector, and the emitter;
coupling a first die to the first collector and a second die to the second collector;
applying bonding material to the first die and to the second die; and
simultaneously mechanically and electrically coupling the first collector, the second collector, and the emitter through bonding an integrally formed clip comprising an M-shape to the first die, to the second die, and to the emitter through the bonding material.
18. The method of claim 17 , wherein the substrate comprises of at least one of copper, silicon, and any combination thereof.
19. The method of claim 17 , wherein the bonding material is selected from the group consisting of a solder paste, a solder wire, a preform solder, a sintered Ag metal, a sintered Ag laminate, and any combination thereof.
20. The method of claim 17 , wherein the clip comprises an electrically conductive material selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, steel, brass, nickel, tin, and any combination thereof.