IP Library Assignment 047734/0068
Patent Assignment
Reel/Frame 047734/0068

Security Interest

Recorded: 2018-12-06 Pages: 14
Assignor
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties (88)
Methods and Apparatus for an Image Sensor with a Multi-Branch Transistor
Application: 15/861,722 →
Publication: US 2018/0130839
Image Sensors with Split Photodiodes
Application: 15/864,164 →
Publication: US 2019/0215471
Press-Fit Power Module and Related Methods
Application: 15/865,498 →
Publication: US 2019/0214749
Cascode Semiconductor Package and Related Methods
Application: 15/866,248 →
Publication: US 2018/0130726
Hybrid Control Technique for Power Converters
Application: 15/867,212 →
Publication: US 2018/0131285
Active Output Driver Supply Compensation for Noise Reduction
Application: 15/868,142 →
Publication: US 2018/0139550
Power Supply Controller and Related Methods
Application: 15/868,690 →
Publication: US 2018/0138807
Substrate Structures and Methods of Manufacture
Application: 15/868,747 →
Publication: US 2018/0132358
Low Frequency Modulated Chirp Minimum Distance Measurement
Application: 15/868,801 →
Publication: US 2019/0212423
Imaging Systems Having Broadband Monochromatic and Chromatic Image Sensors
Application: 15/869,221 →
Publication: US 2019/0222813
Rotor Position Sensing System for Permanent Magnet Synchronous Motors and Related Methods
Application: 15/869,356 →
Publication: US 2018/0175755
Adaptive Dynamic Element Matching of Circuit Components
Application: 15/869,757 →
Semiconductor Packages with Leadframes and Related Methods
Application: 15/870,215 →
Publication: US 2018/0138144
Reducing Mosfet Body Current
Application: 15/871,231 →
Semiconductor Devices and Methods of Making the Same
Application: 15/871,414 →
Publication: US 2018/0138109
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
Application: 15/871,586 →
Publication: US 2018/0151526
Method of Separating Electronic Devices Having a Back Layer and Apparatus
Application: 15/874,307 →
Publication: US 2018/0158734
High Power Module Semiconductor Package with Multiple Submodules
Application: 15/874,355 →
Publication: US 2019/0221493
Apparatus and Method Related to Sensor Die Esd Protection
Application: 15/876,328 →
Publication: US 2019/0229143
Methods and Apparatus for a Capacitive Touch Sensor
Application: 15/876,417 →
Publication: US 2019/0227648
Adaptive Control of Synchronous Rectifier Switching Device
Application: 15/877,573 →
Publication: US 2019/0229634
Bidirectional Current Sense Amplifier
Application: 15/877,804 →
Publication: US 2019/0068144
Cascode Configured Semiconductor Component
Application: 15/882,478 →
Publication: US 2018/0166557
Trench Semiconductor Device Having Shaped Gate Dielectric and Gate Electrode Structures and Method
Application: 15/883,500 →
Publication: US 2019/0237588
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Application: 15/883,625 →
Publication: US 2018/0174881
Battery Protection System with Reference Voltage Control System
Application: 15/883,687 →
Publication: US 2018/0159314
Image Sensor Chip Scale Packages and Related Methods
Application: 15/884,596 →
Publication: US 2018/0151621
TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs)
Application: 15/884,773 →
Publication: US 2019/0058055
Trench-Gate Insulated-Gate Bipolar Transistors
Application: 15/884,779 →
Publication: US 2019/0058056
Devices, Systems and Processes for Average Current Control
Application: 15/888,290 →
Publication: US 2018/0159420
Low-Latency Streaming for Cros and Bicros
Application: 15/888,313 →
Publication: US 2019/0246221
Devices, Systems and Processes for Average Current Control
Application: 15/888,343 →
Publication: US 2018/0183316
Composite Acoustic Bursts for Multi-Channel Sensing
Application: 15/888,471 →
Publication: US 2019/0025415
Response-Based Determination of Piezoelectric Transducer State
Application: 15/888,543 →
Publication: US 2019/0079173
Measuring Resonance Parameters of Piezoelectric Transducers
Application: 15/888,596 →
Publication: US 2019/0079174
Control Circuit for Programmable Power Supply
Application: 15/891,035 →
Publication: US 2018/0164861
Packaged Semiconductor Devices with Multi-Use Input Contacts and Related Methods
Application: 15/891,135 →
Publication: US 2018/0166378
Methods and Apparatus for a Current Circuit
Application: 15/891,474 →
Publication: US 2019/0245328
Semiconductor Package with Chamfered Corners and Related Methods
Application: 15/892,114 →
Semiconductor Copper Metallization Structure and Related Methods
Application: 15/892,485 →
Publication: US 2018/0166407
Signal Communication for Circuit with Floating Ground
Application: 15/892,609 →
Alternating Valley Switching for Power Converter
Application: 15/893,300 →
Publication: US 2018/0166993
Electronic Device Including a Conductive Layer Including a Ta-Si Compound and a Process of Forming the Same
Application: 15/893,328 →
Publication: US 2019/0252509
Level-Shifting Circuit Configured to Limit Leakage Current
Application: 15/893,909 →
Publication: US 2019/0253040
Methods and Apparatus for Anti-Eclipse Circuit Verification
Application: 15/895,354 →
Publication: US 2019/0253646
Image Sensors with Deep Silicon Etch and Related Methods
Application: 15/895,668 →
Publication: US 2019/0252333
Error Rate Meter Included in a Semiconductor Die
Application: 15/895,784 →
Publication: US 2019/0025372
Imaging Systems Having Dual Storage Gate Overflow Capabilities
Application: 15/900,136 →
Publication: US 2019/0260949
Power Factor Correction Circuit and Driving Method Thereof
Application: 15/901,228 →
Publication: US 2018/0183326
Semiconductor Device with Backmetal and Related Methods
Application: 15/903,677 →
Publication: US 2019/0267344
Semiconductor Device and Method of Forming Cantilevered Protrusion on a Semiconductor Die
Application: 15/903,704 →
Publication: US 2018/0182698
Negative Voltage Detection and Voltage Surge Protection
Application: 15/904,506 →
Publication: US 2019/0267792
Image Sensors Having High Dynamic Range Functionalities
Application: 15/906,619 →
Publication: US 2018/0191969
Semiconductor Wafer and Method of Probe Testing
Application: 15/907,931 →
Publication: US 2018/0190552
Imaging Systems with Clear Filter Pixels
Application: 15/908,319 →
Publication: US 2018/0192011
Methods and Apparatus for an Encoder
Application: 15/908,931 →
Publication: US 2019/0271961
Method for Operating an Electronic Module
Application: 15/908,981 →
Publication: US 2018/0188345
Low Noise Differential Amplifier
Application: 15/909,098 →
Publication: US 2019/0273471
Electronic Device Including a Junction Field-Effect Transistor Having a Gate Within a Well Region and a Process of Forming the Same
Application: 15/909,622 →
Publication: US 2019/0273169
Preamplifier and Method
Application: 15/911,476 →
Publication: US 2018/0198423
Power Domain Having an Implementation of an on-Chip Voltage Regulator Device
Application: 15/911,894 →
Publication: US 2019/0272023
Cascode Circuit Having a Gate of a Low-Side Transistor Coupled to a High-Side Transistor
Application: 15/911,999 →
Publication: US 2018/0197851
Clip and Related Methods
Application: 15/912,267 →
Publication: US 2018/0197836
Imaging Pixels with Storage Capacitors
Application: 15/914,122 →
Publication: US 2019/0230294
Ignition Control System for a High-Voltage Battery System
Application: 15/914,370 →
Publication: US 2019/0280464
Electronic Device Including a Transistor Including Iii-V Materials and a Process of Forming the Same
Application: 15/916,428 →
Dual Conversion Gain Circuitry with Buried Channels
Application: 15/916,947 →
Publication: US 2019/0280031
Imaging Systems with Boosted Control Signals
Application: 15/918,067 →
Publication: US 2019/0281243
Schottky Device and Method of Manufacture
Application: 15/919,475 →
Publication: US 2019/0288125
Multi-Chip Packages with Stabilized Die Pads
Application: 15/919,516 →
Publication: US 2019/0287884
Variable Resistance Vias and Related Methods
Application: 15/920,880 →
Publication: US 2018/0331045
Thinned Semiconductor Package and Related Methods
Application: 15/921,898 →
Publication: US 2019/0287913
Embedded Stacked Die Packages and Related Methods
Application: 15/926,127 →
Publication: US 2018/0211939
Methods and Apparatus for an Image Sensor Capable of Simultaneous Integration of Electrons and Holes
Application: 15/928,450 →
Publication: US 2019/0297292
Smart Turn-Off for Gate Driver Circuit
Application: 15/935,291 →
Publication: US 2019/0296728
Method of Forming a Power Supply Control Circuit and Structure Therefor
Application: 15/935,840 →
Method of Separating a Back Layer on a Substrate Using Exposure to Reduced Temperature and Related Apparatus
Application: 15/938,115 →
Publication: US 2018/0342423
CISCSP Package and Related Methods
Application: 15/939,582 →
Publication: US 2019/0006531
Leadframe with Sockets for Solderless Pins
Application: 15/939,632 →
Publication: US 2019/0304883
Ultra-Thin Multichip Power Devices
Application: 15/939,843 →
Publication: US 2019/0304940
Fast Response for Current Doubling Dc-Dc Converter
Application: 15/940,299 →
Current Doubling Dc-Dc Converter with Efficient Sleep Mode
Application: 15/940,362 →
Leadframe with Efficient Heat Dissipation for Semiconductor Device Package Assembly
Application: 15/941,424 →
Pulse Width Control for Switching Mode Power Converters
Application: 15/941,528 →
Publication: US 2018/0337599
Methods and Apparatus for a Microphone System
Application: 62/620,707 →
Capacitors with Electrode Topography
Application: 62/621,265 →
Ultra-Low Leakage Diode Circuit
Application: 62/647,322 →
Electronic Device Including an Enhancement-Mode Hemt and a Method of Using the Same
Application: 62/649,249 →
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2018
From: MAURITZSON, RICHARD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044532/0219 →
Assignment of Assignor's Interest Jan 8, 2018
From: OH, MINSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044558/0059 →
Assignment of Assignor's Interest Jan 9, 2018
From: CHANG, JIE; CHEN, HUIBIN; MALDO, TIBURCIO; LEE, KEUNHYUK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044571/0280 →
Assignment of Assignor's Interest Jan 9, 2018
From: LE, PHUONG TRONG; YOUNG, ALEXANDER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044577/0768 →
Assignment of Assignor's Interest Jan 10, 2018
From: STULER, ROMAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044587/0624 →
Assignment of Assignor's Interest Jan 11, 2018
From: LIN, YUSHENG; TAKAKUSAKI, SADAMICHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044602/0707 →
Assignment of Assignor's Interest Jan 11, 2018
From: COENEN, IVO LEONARDUS; HEUBI, ALEXANDER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044598/0227 →
Assignment of Assignor's Interest Jan 11, 2018
From: PFOF, ZDENEK; BUBLA, JIRI; VECERA, IVO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044602/0399 →
Assignment of Assignor's Interest Jan 11, 2018
From: HUSTAVA, MAREK; SUCHY, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044603/0064 →
Assignment of Assignor's Interest Jan 12, 2018
From: KANE, PAUL JAMES; JENKIN, ROBIN BRIAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044605/0810 →
Assignment of Assignor's Interest Jan 12, 2018
From: OKUBAYASHI, MASANORI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044606/0685 →
Assignment of Assignor's Interest Jan 15, 2018
From: SEDDON, MICHAEL J.; NOMA, TAKASHI; SATO, KAZUHIRO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044622/0835 →
Assignment of Assignor's Interest Jan 15, 2018
From: EGGERMONT, JEAN-PAUL; JANSSENS, JOHAN CAMIEL JULIA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044620/0386 →
Assignment of Assignor's Interest Jan 15, 2018
From: CELAYA, PHILLIP; LETTERMAN, JAMES P., JR.; MARQUIS, ROBERT L.; TRUHITTE, DARRELL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044620/0851 →
Assignment of Assignor's Interest Jan 15, 2018
From: ST. GERMAIN, STEPHEN; ARBUTHNOT, ROGER M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044621/0872 →
Assignment of Assignor's Interest Jan 17, 2018
From: JASA, HRVOJE; DAIGLE, TYLER; JORDAN, ANDREW; MAHER, GREGORY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044642/0528 →
Assignment of Assignor's Interest Jan 18, 2018
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044657/0120 →
Assignment of Assignor's Interest Jan 25, 2018
From: CHANG, JIE; CHEN, HUIBIN; LEE, KEUNHYUK; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044726/0412 →
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064160/0027 →
Security Interest Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →