Leadframe with efficient heat dissipation for semiconductor device package assembly
In a general aspect, a semiconductor device package assembly can include a first leadframe portion. The first leadframe portion can have a recessed region defined therein. The recessed region can have a sidewall and a bottom. The assembly can also include a second leadframe portion that is press-fit into the recessed region, such that a bottom surface of the second leadframe portion is in contact with the bottom of the recessed region. The second leadframe portion can be retained in the recessed region by mechanical force between an outer surface of the second leadframe portion and an inner surface of the sidewall, where the outer surface of the second leadframe portion can be in contact with the inner surface of the sidewall.
1. A semiconductor device package assembly comprising:
a first leadframe portion, the first leadframe portion having a recessed region defined therein, the recessed region having a sidewall and a bottom; and
a second leadframe portion that is press-fit into the recessed region, such that a bottom surface of the second leadframe portion is in contact with the bottom of the recessed region,
the second leadframe portion being retained in the recessed region by mechanical force between an outer surface of the second leadframe portion and an inner surface of the sidewall, the outer surface of the second leadframe portion being in contact with the inner surface of the sidewall.
2. The semiconductor device package assembly of claim 1 , wherein:
the first leadframe portion is formed from a first metal sheet having a first uniform thickness; and
the second leadframe portion is formed from a second metal sheet having a second uniform thickness.
3. The semiconductor device package assembly of claim 2 , wherein the first uniform thickness is approximately equal to the second uniform thickness.
4. The semiconductor device package assembly of claim 1 , wherein the bottom defines a plane, the sidewall being orthogonal with the plane.
5. The semiconductor device package assembly of claim 1 , wherein a perimeter of the second leadframe portion corresponds with a perimeter of the recessed region, the surface of the second leadframe portion that is in contact with the sidewall being an outer edge of the second leadframe portion, the sidewall defining the perimeter of the recessed region.
6. The semiconductor device package assembly of claim 1 , the second leadframe portion including at least one heat-radiating fin.
7. The semiconductor device package assembly of claim 1 , wherein the second leadframe portion includes a recessed region defined therein, the recessed region of the second leadframe portion being press-fit into the recessed region of the first leadframe portion.
8. The semiconductor device package assembly of claim 1 , wherein the second leadframe portion includes a recessed region defined therein, the recessed region of the first leadframe portion being press-fit into the recessed region of the second leadframe portion.
9. The semiconductor device package assembly of claim 1 , wherein the recessed region is defined using a metal stamping process.
10. The semiconductor device package assembly of claim 1 , wherein the second leadframe portion is press-fit into the recessed region using a metal stamping process.
11. The semiconductor device package assembly of claim 1 , further comprising a semiconductor die coupled to one of:
an upper surface of the second leadframe portion; or
a bottom surface of the first leadframe portion on an underside of the recessed region of the first leadframe portion.
12. The semiconductor device package assembly of claim 11 , further comprising an electrical connection between the semiconductor die and a signal terminal included in the first leadframe portion.
13. The semiconductor device package assembly of claim 12 , wherein the electrical connection includes a wire bond.
14. The semiconductor device package assembly of claim 11 , further comprising an electrical connection between the semiconductor die and a signal terminal included in the second leadframe portion.
15. The semiconductor device package assembly of claim 11 , wherein the upper surface of the second leadframe portion is a bottom of the recessed region of the second leadframe portion.
16. A semiconductor device package assembly comprising:
a first leadframe portion, the first leadframe portion having a recessed region defined therein, the recessed region having a bottom and a sidewall, the bottom defining a plane, the sidewall being orthogonal to the plane; and
a second leadframe portion that is press-fit into the recessed region, such that:
a first portion of the second leadframe portion is disposed within the recessed region, and in contact with the sidewall and the bottom of the recessed region; and
a second portion of the second leadframe portion is disposed outside the recessed region.
17. The semiconductor device package assembly of claim 16 , further comprising a semiconductor die coupled to one of:
an upper surface of the second leadframe portion; or
a bottom surface of the first leadframe portion on an underside of the recessed region.
18. The semiconductor device package assembly of claim 16 , wherein the second leadframe portion includes a recessed region defined therein, the recessed region of the second leadframe portion being press-fit into the recessed region of the first leadframe portion.
19. A method comprising:
forming a recessed region in a first leadframe portion, the recessed region having a sidewall and a bottom; and
press-fitting a second leadframe portion into the recessed region, such that a bottom surface of the second leadframe portion is in contact with the bottom of the recessed region,
the second leadframe portion being retained in the recessed region by mechanical force between an outer surface of the second leadframe portion and an inner surface of the sidewall, the outer surface of the second leadframe portion being in contact with the inner surface of the sidewall.
20. The method of claim 19 , wherein:
forming the recessed region includes forming the recessed region using a metal stamping process; and
press-fitting the second leadframe portion into the recessed region includes press-fitting the second leadframe portion into the recessed region using a metal stamping process.
21. The method of claim 19 , further comprising:
coupling a semiconductor die to one of:
an upper surface of the second leadframe portion; or
a bottom surface of the first leadframe portion on an underside of the recessed region of the first leadframe portion.