Leadframe with sockets for solderless pins
A semiconductor package assembly has a leadframe that includes a socket member into which solderless pins may be inserted as interconnects to an external component. The cost of manufacturing such a leadframe is reduced without sacrificing the ability to make solderless connections with external components such as PCBs. For example, instead of using a hard material that requires two stamping tools, the leadframes with female sockets may be made using softer copper-based materials. Moreover, the width of such leadframes is significantly smaller than the width of a leadframe with the press-fit pins included. Such a reduced width may further reduce manufacturing costs.
1. An apparatus, comprising:
a leadframe including a socket member, the socket member having a first end portion, a second end portion, and an opening disposed between the first end portion and the second end portion,
the second end portion of the socket member including a bond pad aligned along a same plane as the socket member,
the opening of the socket member being configured to receive a solderless pin;
a semiconductor component electrically connected to the bond pad; and
a molding disposed around at least a portion of the semiconductor component and at least a portion of the leadframe such that the opening is exposed through the molding.
2. The apparatus of claim 1 , wherein the socket member is configured to define at least a portion of an electrical connection between the semiconductor component and an external component.
3. The apparatus of claim 1 , wherein the leadframe is disposed within a plane,
the molding includes a top molding portion disposed above the plane and a bottom molding portion disposed below the plane,
the second end portion is disposed between the top molding portion and the bottom molding portion.
4. The apparatus of claim 3 , wherein the socket member is a first socket member, and
the apparatus further comprising:
a second socket member having a first end portion, a second end portion, and an opening disposed between the first end portion and the second end portion, the second end portion of the second socket member being disposed between the top molding portion and the bottom molding portion.
5. The apparatus of claim 4 , wherein the opening of the first socket member is disposed on a first line within the plane, the first line being parallel with an edge of the top molding portion, and
the opening of the second socket member is disposed on a second line different than the first line.
6. The apparatus of claim 3 , wherein the opening of the socket member is in fluid communication with a hole in the bottom molding portion, the hole having an axis of symmetry, the opening having a same axis of symmetry as the hole.
7. The apparatus of claim 6 , wherein a wall of the hole is sloped so that a diameter of the hole at a bottom of the hole is larger than a diameter of the opening.
8. The apparatus of claim 6 , wherein the hole is configured to conform to a shape of the solderless pin in response to the opening of the socket member receiving the solderless pin.
9. The apparatus of claim 1 , wherein the molding includes a top molding portion and a bottom molding portion, and
the top molding portion has an edge offset from an end of the bottom molding portion such that a recessed area is defined.
10. The apparatus as in claim 9 , wherein the opening of the socket member is exposed within the recessed area.
11. A semiconductor package assembly, comprising:
a bottom molding portion;
a top molding portion having an edge offset from an edge of the bottom molding portion such that a recessed area is defined;
a leadframe including a socket member having a first end portion, a second end portion, and an opening disposed between the first end portion and the second end portion,
the opening of the socket member being exposed within the recessed area; and
a semiconductor component disposed between the top molding portion and the bottom molding portion, the semiconductor component being electrically connected to a bond pad of the second end portion of the leadframe, the bond pad being aligned along a same plane as the socket member.
12. The semiconductor package assembly of claim 11 , wherein the opening of the socket member is configured to receive a solderless pin.
13. The semiconductor package assembly of claim 12 , wherein the socket member is configured to define at least a portion of an electrical connection between the semiconductor component and an external component.
14. The semiconductor package assembly of claim 11 , wherein the second end portion is disposed between the top molding portion and the bottom molding portion.
15. The semiconductor package assembly of claim 14 , wherein the socket member is a first socket member, and
the semiconductor package assembly further comprising:
a second socket member having a first end portion, a second end portion, and an opening disposed between the first end portion and the second end portion, the second end portion of the second socket member being disposed between the top molding portion and the bottom molding portion.
16. The semiconductor package assembly of claim 15 , wherein the opening of the first socket member is disposed on a first line within the plane of the socket member, the first line being parallel with an edge of the top molding portion, and
the opening of the second socket member is disposed on a second line different than the first line.