IP Library › Assignment 045065/0104
Patent Assignment
Reel/Frame 045065/0104

Assignment of Assignor's Interest

Recorded: 2018-02-28 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2018-02-27
LEE, HENG CHEN
Executed: 2018-02-28
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Wafer and Method of Probe Testing
Application: 15/907,931 →
Publication: US 2018/0190552
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 6, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047734/0068 →
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064160/0027 →