IP Library › Assignment 045100/0884
Patent Assignment
Reel/Frame 045100/0884

Assignment of Assignor's Interest

Recorded: 2018-03-04 Pages: 7
Assignors
WAN, ALBERT
Executed: 2017-07-19
SHIH, CHAO-WEN
Executed: 2017-07-19
CHANG, SHOU-ZEN
Executed: 2018-01-04
CHUANG, NAN-CHIN
Executed: 2018-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property (1)
Package Structure and Manufacturing Method Thereof
Application: 15/652,249 →
Publication: US 2019/0027449
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 4, 2018
From: WAN, ALBERT; SHIH, CHAO-WEN; CHANG, SHOU-ZEN; CHUANG, NAN-CHIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 045100/0879 →