Patent Assignment
Reel/Frame 045122/0644
Assignment of Assignor's Interest
Recorded: 2018-03-06
Pages: 7
Assignors
OSADA, TATSUYA
Executed: 2018-01-25
EGASHIRA, MASAHIKO
Executed: 2018-01-25
UCHINO, TOMOKATSU
Executed: 2018-01-25
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Wafer Inspection Method and Wafer Inspection Apparatus