Patent Assignment
Reel/Frame 045191/0837
Assignment of Assignor's Interest
Recorded: 2018-03-13
Pages: 3
Assignor
GHANNAM, AYAD
Executed: 2018-03-01
Assignee
3DIS TECHNOLOGIES
478 RUE DE LA DÉCOUVERTE, LABEGE, 31670, FRANCE
Covered Property
(1)
Method for Integrating at Least One 3D Interconnection for the Manufacture of an Integrated Circuit