Patent Assignment
Reel/Frame 045202/0019
Assignment of Assignor's Interest
Recorded: 2018-03-14
Pages: 7
Assignors
LEE, HYUN-JUNG
Executed: 2018-01-03
WOO, DONGSOO
Executed: 2018-01-03
LEE, JIN-SEONG
Executed: 2018-01-03
JEON, NAMHO
Executed: 2018-01-03
HONG, JAEHO
Executed: 2018-01-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device and Method of Manufacturing the Same