Patent Assignment
Reel/Frame 045202/0342
Assignment of Assignor's Interest
Recorded: 2018-03-14
Pages: 3
Assignors
OKA, TOHRU
Executed: 2018-03-05
TANAKA, NARIAKI
Executed: 2018-03-05
NISHII, JUNYA
Executed: 2018-03-05
Assignee
TOYODA GOSEI CO., LTD.
1 HARUHINAGAHATA, KIYOSU-SHI, AICHI-KEN, 452-8564, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device and Edge Termination Structure of Semiconductor Device