Patent Assignment
Reel/Frame 045249/0505
Corrective Assignment to Correct the Execution Date of the Sixth Inventor. Previously Recorded at Reel: 044472 Frame: 0382. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2018-02-05
Pages: 7
Assignors
ODA, DAIZO
Executed: 2016-10-04
ETO, MOTOKI
Executed: 2016-10-04
SAITO, KAZUYUKI
Executed: 2016-10-04
HAIBARA, TERUO
Executed: 2016-10-04
OISHI, RYO
Executed: 2016-10-04
YAMADA, TAKASHI
Executed: 2016-10-06
UNO, TOMOHIRO
Executed: 2016-10-03
Assignees
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 104-0061, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 22, 2017
From: ODA, DAIZO; ETO, MOTOKI; SAITO, KAZUYUKI; HAIBARA, TERUO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 044472/0382 →
Merger and Change of Name
May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →