Patent Assignment
Reel/Frame 045277/0321
Assignment of Assignor's Interest
Recorded: 2018-03-19
Pages: 4
Assignors
YU, CHI-YANG
Executed: 2018-02-13
CHEN, HAI-MING
Executed: 2018-02-13
LIANG, YU-MIN
Executed: 2018-02-13
CHENG, JUNG WEI
Executed: 2018-02-13
LEE, CHIEN-HSUN
Executed: 2018-02-13
Assignee
, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Planarization of Semiconductor Packages and Structures Resulting Therefrom