Patent Assignment
Reel/Frame 045282/0368
Assignment of Assignor's Interest
Recorded: 2018-03-20
Pages: 8
Assignors
CHEN, LI-CHIANG
Executed: 2018-03-14
LEE, FU-CHE
Executed: 2018-03-14
KUO, MING-FENG
Executed: 2018-03-14
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Method of Improving Micro-Loading Effect When Recess Etching Tungsten Layer