Patent Assignment
Reel/Frame 045287/0187
Assignment of Assignor's Interest
Recorded: 2018-03-20
Pages: 7
Assignors
LIN, YUSHENG
Executed: 2016-07-26
CARNEY, FRANCIS J.
Executed: 2016-07-27
WEN, YENTING
Executed: 2016-07-13
CHEW, CHEE HIONG
Executed: 2016-07-12
ARIPIN, AZHAR
Executed: 2016-07-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Embedded Stacked Die Packages and Related Methods
Application:
15/926,127 →
Publication:
US 2018/0211939
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 6, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047734/0068 →
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064160/0027 →