Patent Assignment
Reel/Frame 045315/0926
Assignment of Assignor's Interest
Recorded: 2018-03-22
Pages: 6
Assignors
LEE, JUNG HWAN
Executed: 2018-01-02
KIM, JEE YONG
Executed: 2018-01-03
YUN, SEOK JUNG
Executed: 2018-01-02
LEE, JI HYEON
Executed: 2018-01-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Device