Patent Assignment
Reel/Frame 045385/0923
Assignment of Assignor's Interest
Recorded: 2018-03-29
Pages: 5
Assignor
YAMADA, HIROSHI
Executed: 2018-02-22
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Wafer Inspection Method and Wafer Inspection Device