Wafer inspection method and wafer inspection device
Provided is a wafer inspection method wherein a chuck top can be properly received. When an aligner receives a chuck top after a wafer W has been inspected, the distance between the chuck top and a chuck base is adjusted by adjusting the inclination of the chuck base such that the chuck top height, which is the distance between the chuck top and the chuck base after the chuck top is held, is a height in which any of 0 to 200 μm is added to the chuck top height before the chuck top is held.
1. A wafer inspection method in which a wafer mounted on a chuck top is brought into contact with a probe card having a plurality of contact terminals, comprising:
storing, before the wafer is in contact with the probe card, a relative positional relationship between the chuck top and an aligner, which adjusts an inclination of the chuck top, when the chuck top is attached to the aligner;
inspecting the wafer by moving the chuck top so that the wafer makes contact with the probe card;
adjusting, after inspecting the wafer, a distance between the aligner and the chuck top, on which the wafer in contact with the probe card is mounted, based on the relative positional relationship stored; and
receiving, by the aligner, the chuck top together with the wafer.
2. The wafer inspection method of claim 1 , wherein the aligner has a chuck base on which the chuck top is mounted,
wherein storing the relative positional relationship includes storing a relative positional relationship between the chuck top and the chuck base when the chuck top is mounted on the chuck base, and
wherein adjusting the distance between the aligner and the chuck top includes inclining the chuck base so that a distance between the chuck top, on which the wafer in close contact with the probe card is mounted, and the chuck base is adjusted based on the relative positional relationship stored.
3. The wafer inspection method of claim 2 , wherein the relative positional relationship stored is a distance between the chuck top and a predetermined position of the chuck base when the chuck top is mounted on the chuck base, and
wherein adjusting the distance between the aligner and the chuck top includes inclining the chuck base so that the distance between the chuck top, on which the wafer in contact with the probe card is mounted, and the predetermined position of the chuck base is set to a distance obtained by adding a predetermined raising distance to the distance between the chuck top and the predetermined position of the chuck base when the chuck top is mounted on the chuck base.
4. The wafer inspection method of claim 3 , wherein the predetermined raising distance is a value from 0 to 200 μm.
5. The wafer inspection method of claim 1 , further comprising:
before adjusting the distance between the aligner and the chuck top, measuring the relative positional relationship between the aligner and the chuck top, on which the wafer in contact with the probe card, is mounted.
6. The wafer inspection method of claim 3 , wherein, after the distance between the chuck top, on which the wafer in contact with the probe card is mounted, and the predetermined position of the chuck base is set to the distance obtained by adding the predetermined raising distance to the distance between the predetermined position of the chuck top and the chuck base when the chuck top is mounted on the chuck base, a contact state of the wafer with the probe card is released, the chuck top is lowered toward the chuck base, and the chuck base receives the chuck top together with the wafer.
7. The wafer inspection method of claim 2 , further comprising:
before storing the relative positional relationship, mounting the chuck top on the chuck base and positioning the chuck top with respect to the chuck base.
8. A wafer inspection device in which a wafer mounted on a chuck top is brought into contact with a probe card having a plurality of contact terminals, comprising:
an aligner configured to adjust an inclination of the chuck top; and
a sensor configured to measure a relative positional relationship between the chuck top and the aligner,
wherein the aligner is allowed to be separated from the chuck top,
wherein the sensor measures, before the wafer makes contact with the probe card, the relative positional relationship between the aligner and the chuck top when the chuck top is attached to the aligner,
wherein the probe card inspects the wafer when the chuck top is moved so that the wafer is in contact with the probe card, and
wherein the aligner receives, after the wafer is inspected, the chuck top together with the wafer by adjusting a distance between the chuck top, on which the wafer in contact with the probe card is mounted, and the aligner based on the relative positional relationship measured.
9. The wafer inspection device of claim 8 , wherein the aligner has a chuck base on which the chuck top is mounted,
wherein the sensor measures a relative positional relationship between the chuck top and the chuck base when the chuck top is mounted on the chuck base, and
wherein the aligner is configured to incline the chuck base so that a distance between the chuck top, on which the wafer in contact with the probe card is mounted, and the chuck base is adjusted based on the relative positional relationship measured.
10. The wafer inspection device of claim 8 , further comprising:
a plurality of probe cards; and
a stage configured to move the chuck top toward the probe card.