Patent Assignment
Reel/Frame 045390/0983
Assignment of Assignor's Interest
Recorded: 2018-03-29
Pages: 3
Assignors
IWAI, YU
Executed: 2018-01-29
KAWABATA, TAKESHI
Executed: 2018-01-29
SHIBUYA, AKINORI
Executed: 2018-01-29
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, 106-8620, JAPAN
Covered Property
(1)
Laminate, Method for Manufacturing Laminate, Semiconductor Device, and Method for Manufacturing the Semiconductor Device