IP Library › Assignment 045427/0788
Patent Assignment
Reel/Frame 045427/0788

Assignment of Assignor's Interest

Recorded: 2018-04-03 Pages: 4
Assignors
IGETA, MASAHIKO
Executed: 2018-04-03
TERUI, YOSHIMI
Executed: 2018-04-03
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Apparatuses and Methods for Coupling Contact Pads to a Circuit in a Semiconductor Device
Application: 15/944,497 →
Publication: US 2019/0304855
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →