Patent Assignment
Reel/Frame 045549/0687
Assignment of Assignor's Interest
Recorded: 2018-04-16
Pages: 3
Assignors
KHADERBAD, MRUNAL A.
Executed: 2018-03-23
OKUNO, YASUTOSHI
Executed: 2018-03-23
TSAI, PANG-YEN
Executed: 2018-03-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device, Interconnection Structure and Method for Forming the Same