Patent Assignment
Reel/Frame 045554/0423
Assignment of Assignor's Interest
Recorded: 2018-04-16
Pages: 4
Assignors
SON, SOO HWAN
Executed: 2018-03-30
CHOI, JAE YEOL
Executed: 2018-03-30
AHN, YOUNG GHYU
Executed: 2018-03-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component