IP Library › Assignment 045574/0301
Patent Assignment
Reel/Frame 045574/0301

Assignment of Assignor's Interest

Recorded: 2018-03-13 Pages: 9
Assignors
YOON, TAE HO
Executed: 2016-04-14
JUNG, YANG GYOO
Executed: 2016-05-10
KIM, MIN HO
Executed: 2016-04-05
SONG, YOUN SEOK
Executed: 2016-04-06
RYU, DONG SOO
Executed: 2016-04-05
KIM, CHOONG HOE
Executed: 2016-03-31
Assignee
AMKOR TECHNOLOGY, INC
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
System and Method for Laser Assisted Bonding of Semiconductor Die
Application: 15/919,569 →
Publication: US 2018/0204740
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →