IP Library › Assignment 045592/0093

Patent Assignment

Reel/Frame 045592/0093

Assignment of Assignor's Interest

Recorded: 2018-04-19 Pages: 3

View PDF Order Certified Copy

Assignor

WU, WENG-JIN

Executed: 2017-01-13

Assignee

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

5005 E. MCDOWELL RD., A700, PHOENIX, ARIZONA, 85008

Covered Property (1)

Molded Image Sensor Chip Scale Packages and Related Methods

Patent: 10,910,421 →

Application: 15/957,520 →

Publication: US 2018/0240828

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.

Patent Security Agreement Oct 16, 2018

From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION

To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT

Reel/Frame 047864/0611 →

Release of Security Interest in Patents Recorded at Reel 047864, Frame 0611 Jun 23, 2023

From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT

To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION

Reel/Frame 064077/0298 →