Patent Assignment
Reel/Frame 045599/0648
Assignment of Assignor's Interest
Recorded: 2018-04-20
Pages: 7
Assignors
KIM, SUNG-YEOL
Executed: 2018-03-17
KIM, JAE-HONG
Executed: 2018-03-17
LEE, KYUNG-MIN
Executed: 2018-03-17
LIM, MEE-HYUN
Executed: 2018-03-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Testing an Interconnect Circuit and Method for Manufacturing a Semiconductor Device Including the Test Method